Semiconductors & Electronics
UTAC (United Test and Assembly Center)
UNCLAIMED RECORD · Claim it →A Singapore-headquartered independent OSAT with multiple Ang Mo Kio and Serangoon plants. Packaging spans leadframe, laminate, MEMS and sensors, image sensors, SiP, WLCSP and bumping, and power; test covers wafer sort, final test and market-specific test across automotive, communications, computing, consumer and industrial.
Capabilities
Sources
CLAIM THIS RECORD
Is this your company?
UTAC (United Test and Assembly Center) is on the Singapore Industry Index as a reference record, compiled from public sources. Claiming it is free — correct the facts, add capabilities and certifications, appear on more pages, and receive enquiries routed directly to you.
Spotted an error? Claiming is the fastest way to fix it — or write to us via Contact.
Capability data
- Capabilities
- Semiconductor assembly and test
- Processes
- Leadframe packagingLaminate packagingSystem-in-packageWafer-level packagingWafer bumpingWafer sort
- Location
- Singapore
From the Singapore Industry Index capability record.