Semiconductors & Electronics
Leading semiconductor companies in Singapore
Singapore makes about one in ten of the world's chips, and a fifth of the world's semiconductor equipment is manufactured here, by the government's own count — from 300mm wafer fabs at Woodlands, Pasir Ris and Tampines to the packaging, test and toolmaking operations around them. The semiconductor companies in Singapore below are the core of that industry: the wafer fabs and foundries, the advanced-packaging and test operators, and the equipment makers — an unranked, verified set from the Singapore Industry Index's record. The electronics manufacturers that build around them are on the electronics manufacturing list; the contractors who construct the cleanrooms themselves are on the record under cleanroom construction.
The companies
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AEM Holdings
A Singapore-headquartered leader in system-level test and test handling — burn-in, wafer-level and SLT solutions for high-performance and AI compute. SGX-listed, and a key qualified partner to leading device makers.
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Applied Materials (Southeast Asia)
The world's largest semiconductor-equipment maker — deposition, etch, CMP, ion-implant and inspection tools — running its largest manufacturing operations outside the United States in Singapore, and the demand anchor that pulls the entire local component supply chain.
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ASE Singapore
The Singapore site, at Woodlands, of ASE — the world's largest OSAT group. Provides back-end packaging, wafer-level packaging, final test, wafer sort, product engineering and logistics, with a stated focus on connectivity and automotive markets.
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ASML Singapore
The sole supplier of EUV and leading DUV lithography systems, with a significant Singapore manufacturing, logistics and technical operation and a marquee customer for local precision-module suppliers.
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ASMPT
A global leader in back-end assembly and packaging equipment — die-attach, wire bonders, flip-chip and moulding — and SMT solutions. Listed on the SGX alongside its Hong Kong listing, with substantial regional operations.
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AVI-Tech Electronics
An SGX-listed specialist in burn-in, PCB assembly and test and engineering services for high-reliability semiconductor, aerospace and medical markets, operating from Serangoon North in Singapore. Genuine on-island reliability-focused assembly and test.
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Ellipsiz
A Singapore-based provider of semiconductor test, probe-card and test-consumables, and equipment services to fabs and OSATs.
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GlobalFoundries Singapore
The largest pure-play specialty foundry site in Singapore, at Woodlands: about 3,800 employees, roughly 87,000 sq m of cleanroom and around 1.5 million wafers of annual 300mm-equivalent capacity, running both 300mm and 200mm. Its technology menu spans power BCD, RF-SOI, SiGe, silicon photonics and feature-rich CMOS for automotive, mobile, industrial and connectivity markets, and it is the world's largest pure-play silicon-photonics foundry after absorbing Advanced Micro Foundry.
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Infineon (Singapore)
Infineon's Asia-Pacific regional base, at Kallang Way, with back-end and manufacturing activity.
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ISDN Holdings
A Singapore-headquartered motion-control and industrial-automation group, SGX-listed, providing precision manufacturing and systems integration to semiconductor and precision-equipment customers across more than 80 Asian locations. Its Singapore automation and robotics work is delivered through its Servo Dynamics arm.
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KLA (Singapore)
A global leader in process control, metrology and wafer- and reticle-inspection, with established Singapore operations.
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Kulicke & Soffa
A Singapore-headquartered global leader in back-end assembly: wire bonders (ball, wedge, vertical), advanced-packaging and power-assembly systems, dispensing, and consumables such as capillaries and blades. One of Singapore's genuine home-grown equipment champions.
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Lam Research (Singapore)
A front-end leader in etch and deposition, running a major Singapore manufacturing and supply-chain hub serving global demand.
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Micron Technology (Singapore)
An integrated device manufacturer running one of Micron's two global 3D NAND flash memory hubs, at the North Coast Wafer Fab Park — 300mm fabs (Fab 10A, Fab 10X) with roughly 500,000 sq ft of cleanroom each, and Fab 10B under construction to expand NAND capacity for AI and data-centre storage. It has also broken ground on a new HBM advanced-packaging facility nearby — a roughly US$7 billion investment for high-bandwidth-memory packaging, assembly and test, slated to begin from 2026.
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MIT Semiconductor (Manufacturing Integration Technology)
A Singapore-headquartered maker of wafer-handling and JEDEC tray and carrier-tape handling equipment — its Optimus, SmartFlex and Caerus lines — for assembly, test and back-end lines.
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Nanofilm Technologies International
A Singapore-headquartered advanced-materials company whose Filtered Cathodic Vacuum Arc (FCVA) nanotech coatings and surface solutions are used across precision industries and electronics. SGX-listed.
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Silicon Box
An advanced-packaging entrant running a fab at Tampines dedicated to panel-level packaging (PLP) and chiplet interconnection with sub-5-micron fabrication, aimed at AI and high-performance computing. Reported to have shipped over 100 million units — a new entrant already in volume.
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Soitec (Singapore)
An engineered-substrate manufacturer, not a circuit-etching fab: it produces 300mm SOI (silicon-on-insulator) wafers used in smartphone RF front-ends, 5G, automotive and smart devices. A Pasir Ris extension roughly doubles Singapore capacity toward about 2 million 300mm SOI wafers a year. The upstream materials principal that feeds RF-SOI and FD-SOI front-end fabs.
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SSMC — Systems on Silicon Manufacturing Company
A pure-play foundry and a joint venture of TSMC and NXP, running a 200mm specialty fab at Pasir Ris on 0.25 to 0.11-micron processes across CMOS, embedded flash, analog, high-performance mixed-signal, RF, BCD and sensor platforms for connected-car, secure-connectivity, wearable and IoT applications.
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STATS ChipPAC
A Singapore-headquartered independent OSAT and back-end manufacturer, owned by China's JCET Group. Its two Yishun sites cover package design, wafer bumping, flip-chip, wafer-level and SiP packaging and 2.5D/3D advanced packaging, plus wafer probe and final test. Among the largest operating back-end footprints in Singapore.
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STMicroelectronics (Singapore)
An integrated device manufacturer running Singapore's first front-end wafer fab, at Ang Mo Kio, and part of ST's largest global front-end footprint (around 4,400 staff across four Singapore sites). It runs front-end fabrication and electrical wafer sort with a focus on MEMS — including a piezoelectric-MEMS Lab-in-Fab R&D line run with A*STAR and ULVAC — alongside packaging R&D. Its Toa Payoh site operates as a design centre and fab back-end handling assembly and test, while Ang Mo Kio runs electrical wafer sort.
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Sunright
A Singapore-based group in burn-in and test services and burn-in board and test equipment, parent of a major independent test operation.
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Trio-Tech International
A provider of burn-in and test services plus burn-in systems, boards and related equipment for the semiconductor industry, with substantial Singapore and Southeast Asian operations. Nasdaq-listed.
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UMC (Singapore)
A pure-play foundry running a 300mm specialty-technology centre (Fab 12i) at Pasir Ris across a diverse mix of applications. UMC has opened a new adjacent Singapore fab for 22nm and 28nm processes — the most advanced foundry nodes in Singapore — with a first phase of about 30,000 wafers a month and volume production ramping from 2026, aimed at premium display, IoT memory and connectivity chips.
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UTAC (United Test and Assembly Center)
A Singapore-headquartered independent OSAT with multiple Ang Mo Kio and Serangoon plants. Packaging spans leadframe, laminate, MEMS and sensors, image sensors, SiP, WLCSP and bumping, and power; test covers wafer sort, final test and market-specific test across automotive, communications, computing, consumer and industrial.
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VSMC — VisionPower Semiconductor Manufacturing Company
A pre-production joint venture of Vanguard International Semiconductor (TSMC-affiliated) and NXP, building a 300mm specialty-foundry fab at Tampines. Ground was broken in December 2024, with initial production slated for 2027 and a ramp toward about 55,000 wafers a month by 2029.
How this list was made
Companies operating in Singapore in wafer fabrication, advanced packaging, assembly and test, semiconductor test services, and semiconductor equipment, identified from public record and the Singapore Industry Index's own research, presented as an unranked set.
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