Semiconductors & Electronics
STATS ChipPAC
UNCLAIMED RECORD · Claim it →A Singapore-headquartered independent OSAT and back-end manufacturer, owned by China's JCET Group. Its two Yishun sites cover package design, wafer bumping, flip-chip, wafer-level and SiP packaging and 2.5D/3D advanced packaging, plus wafer probe and final test. Among the largest operating back-end footprints in Singapore.
Capabilities
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Capability data
- Capabilities
- Semiconductor assembly and test
- Processes
- Package designWafer bumpingFlip chipWafer-level packagingSystem-in-packageAdvanced packaging
- Location
- Singapore
From the Singapore Industry Index capability record.