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Semiconductors & Electronics

An advanced-packaging entrant running a fab at Tampines dedicated to panel-level packaging (PLP) and chiplet interconnection with sub-5-micron fabrication, aimed at AI and high-performance computing. Reported to have shipped over 100 million units — a new entrant already in volume.

Capabilities

Sources

silicon-box.com ↗

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Capability data

Capabilities
Semiconductor assembly and test
Processes
Panel-level packagingAdvanced packaging
Location
Singapore

From the Singapore Industry Index capability record.