Semiconductors & Electronics
A global leader in back-end assembly and packaging equipment — die-attach, wire bonders, flip-chip and moulding — and SMT solutions. Listed on the SGX alongside its Hong Kong listing, with substantial regional operations.
Capabilities
Sources
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Capability data
- Capabilities
- Semiconductor equipment
- Processes
- Die attachWire bondingFlip chipMouldingSMT placement
- Location
- Singapore
From the Singapore Industry Index capability record.